Manufacturing Process Capabilities

• IPC J-STD-001F, IPC-A-610F Class II & III
• Materials IQC ( C = 0 Sampling Plan )
• SnPb and RoHS Soldering
• Extra Large Board (630x570mm)
• Fine Pitch Components (16 mils)
• Micro BGA, CSP (0.5mm), 0201 chips
• X-Ray, AOI and Digital Microscope
• High Melting Point(HMP) soldering process
• Conformal coating complies to Aerospace std
• TCP ACF Bonding
• In-Circuit Test Fixture & Software Development
• Flying Probe Test Software
• Labview PXI Component Test
• Functional Tester Development
• 2D/3D Barcode Development
• Environment and ESS Testing
• DFM, DFT and CAD Support