Equipment Manufacturing Products

    WAFER UV ERASER SYSTEM I ( AER681 / AER682 )

    Applications
  • Complete erasing of charges of EPROM and Flash memory.
  • UV Curing and Hardening.
  • Removal of stress induce due to manufacturing processes.
    • Features :
  • Flexible to handle 150mm and 200mm wafers without conversion
  • Class 1000 cleanliness
  • Multi wafers UV chamber for high throughput
  • Low cost of ownership
  • Wafer robot handling
  • Cassette to Cassette Transfer
  • Wafer aligner & OCR (Option)


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    WAFER UV ERASER SYSTEM II ( AER8121 )

    Applications
  • Complete erasing of charges of EPROM and Flash memory.
  • UV Curing and Hardening.
  • Removal of stress induce due to manufacturing processes.
    • Features :
  • 300mm ready
  • Class 10 cleanliness
  • Modular design for future expansion
  • Capable of handling thin wafer
  • GEM full compliance
  • Wafer sort - FOUP to FOUP or FOUP to FOSB


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    MACRO AND MICRO OPTICAL WAFER INSPECTION SYSTEM
    ( AWL681 / AWLM681 )

    Applications
  • Wafer Sorting.
  • Optical inspection with Inkless Binning.
    • Features :
  • Atmospheric robot wafer handling
  • Capability to handle thin wafer (>6 mils)
  • Multi function- Cassette to Cassette Sort , Cassette to XY-stage for micro inspection
  • Inkless Binning catered to handle all Semi Std Map Format
  • Macro inspection (Frontside , Backside & Edge defect)
  • Tilting & Spin Module
  • Capable to integrate with any OEM Microscope
  • Optical Character Reader (OCR)
  • Smallest foot print
  • SEC II GEM (Option)
  • Wafer Aligner (Option)


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    WAFER SORTING SYSTEM ( BTC681 )

    Applications
  • Wafer sorting/packing & unpacking
    • Features :
  • Flexible to handle wafer from 120mm, 150mm & 200mm
  • Thin wafer handling capability down to 6 mils
  • SEC/GEM full compliance
  • Enable full wafer integrity and traceability
  • Eliminate human handling
  • Reduces wafer loss and improve yield
  • Safe, automated environment
  • Macro inspection (Frontside, Backside & Edge defect)



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    WAFER SORTING SYSTEM ( BTC8121 )

    Applications
  • Wafer sorting / packing & unpacking
    • Features :
  • 300mm ready
  • Class 10 cleanliness
  • Modular design for future expansion
  • Capable of handling thin wafer
  • GEM full compliance
  • Enable full wafer integrity and traceability
  • Eliminate human handling
  • Reduces wafer loss and improve yield
  • Safe, automated environment


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    OPTICAL INSPECTION MACHINE ( OPT653(V) )

    Applications
  • 3rd Optical Inspection Machine with auto conversion
    • Features :
  • Flexible to handle both lead frame & substrate
  • One touch auto conversion
  • Strip mapping for reject traceability
  • Reject Identification (Wire breaker/inking/scribing)
  • Fine pitch capability for 1x1mm device
  • Angular tilting mechanism to check bonding quality
  • SEMI/CE compliance
  • Networking capability - SECS/GEM
  • 2D vision inspection for Wire & Die


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    CEI Limited is a Listed
    UL 508A Industrial Control Panels Manufacturer

    Our Value Commitment to our Client
  • We will design or custom-build our clients panels to comply with UL 508A requirements
  • We will maintain component documentation necessary to prove compliance
  • We will work closely with our clients to address specific constructions or components used to ensure compliance with UL 508A


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