PCBA

Manufacturing Process Capabilities

• IPC J-STD, IPC-A-610E Class II & III


• Materials IQC (ANSI/ASQC Z1.4)


• SnPb and RoHS Soldering


• Extra Large Board (630x570mm)


• Fine Pitch Components (16 mils)


• Micro BGA, CSP (0.5mm), 0201 chips


• X-Ray, AOI and Digital Microscope


• TCP ACF Bonding


• In-Circuit Test Fixture & Software Development


• Flying Probe Test Software


• Labview PXI Component Test


• Functional Tester Development


• 2D/3D Barcode Development


• Environment and ESS Testing


• DFM, DFT and CAD Support

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