Equipment Manufacturing Products

WAFER UV ERASER SYSTEM I

Applications

AER681 / AER682

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• Complete erasing of charges of EPROM and Flash memory.
• UV Curing and Hardening.
• Removal of stress induce due to manufacturing processes.
  
  

FEATURES:

• Flexible to handle 150mm and 200mm wafers without conversion
  
• Class 1000 cleanliness
  
• Multi wafers UV chamber for high throughput
  
• Low cost of ownership
• Wafer robot handling
• Cassette to Cassette Transfer
• Wafer aligner & OCR (Option)
  

WAFER UV ERASER SYSTEM II

Applications

AER8121

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• Complete erasing of charges of EPROM and Flash memory.
• UV Curing and Hardening.
• Removal of stress induce due to manufacturing processes.
  
  

FEATURES:

• 300mm ready
  
• Class 10 cleanliness
  
• Modular design for future expansion
  
• Capable of handling thin wafer
• GEM full compliance
• Wafer sort - FOUP to FOUP or FOUP to FOSB

MACRO AND MICRO OPTICAL WAFER INSPECTION SYSTEM

( With inkless binning for 200mm Wafers )

Applications

AWL681 / AWLM681

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• Wafer Sorting
• Optical inspection with Inkless Binning

FEATURES:

• Atmospheric robot wafer handling
  
• Capability to handle thin wafer (>6 mils)
  
• Multi function- Cassette to Cassette Sort , Cassette to XY-stage for micro inspection
  
• Inkless Binning catered to handle all Semi Std Map Format
• Macro inspection (Frontside , Backside & Edge defect)
• Tilting & Spin Module
• Capable to integrate with any OEM Microscope
• Optical Character Reader (OCR)
• Smallest foot print
• SEC II GEM (Option)
• Wafer Aligner (Option)

WAFER SORTING SYSTEM

BTC681

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Applications

• Wafer sorting/packing & unpacking.

FEATURES:

• Flexible to handle wafer from 120mm, 150mm & 200mm
  
• Thin wafer handling capability down to 6 mils
  
• SEC/GEM full compliance
  
• Enable full wafer integrity and traceability
• Eliminate human handling
• Reduces wafer loss and improve yield
• Safe, automated environment
• Macro inspection (Frontside, Backside & Edge defect)

WAFER SORTING SYSTEM

Applications

BTC8121

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• Wafer sorting / packing & unpacking.

FEATURES:

• 300mm ready
  
• Class 10 cleanliness
  
• Modular design for future expansion
  
• Capable of handling thin wafer
• GEM full compliance
• Enable full wafer integrity and traceability
• Eliminate human handling
• Reduces wafer loss and improve yield
• Safe, automated environment

OPTICAL INSPECTION MACHINE

Applications

OPT653(V)

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• 3rd Optical Inspection Machine with auto conversion.

FEATURES:

• Flexible to handle both lead frame & substrate
  
• One touch auto conversion
  
• Strip mapping for reject traceability
  
• Reject Identification (Wire breaker/inking/scribing)
• Fine pitch capability for 1x1mm device
• Angular tilting mechanism to check bonding quality
• SEMI/CE compliance
• Networking capability - SECS/GEM
• 2D vision inspection for Wire & Die

CEI Contract Manufacturing Limited is a Listed
UL 508A Industrial Control Panels Manufacturer

UL

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Our Value Commitment to our Client

• We will design or custom-build our clients panels to comply
  with UL 508A requirements
  
• We will maintain component documentation necessary to prove compliance
  
• We will work closely with our clients to address specific
  constructions or components used to ensure compliance with
  UL 508A