PCBA

Manufacturing Process Capabilities

• IPC J-STD 001, IPC 610D Class II & III


• Materials IQC (ANSI/ASQC Z1.4)


• SnPb and RoHS Soldering


• Extra Large Board (630x570mm)


• Fine Pitch Components (16 mils)


• Micro BGA, CSP (0.5mm), 0201 chips


• X-Ray, AOI and Digital Microscope


• TCP ACF Bonding


• In-Circuit Test Fixture & Software Development


• Flying Probe Test Software


• Labview PXI Component Test


• Functional Tester Development


• 2D/3D Barcode Development


• Environment and ESS Testing


• DFM, DFT and CAD Support

Equipment Manufacturing

Manufacturing Expertise

• Multi-sites Turnkey Equipment, Module assembly, Refurbishment and Spare Part Support


• Program management


• Quality management


• Global supply chain management


• Inventory management


• Cost improvement program through value engineering & localisation program


• Intellectual property management

Engineering Expertise

• Capable of taking projects from concept to completion


• Full Product development and design


• Design, fabrication, assembly, testing and commissioning of equipments


• Provide other value added services such as documentation, product transfer and training